JPH0119770Y2 - - Google Patents
Info
- Publication number
- JPH0119770Y2 JPH0119770Y2 JP4552783U JP4552783U JPH0119770Y2 JP H0119770 Y2 JPH0119770 Y2 JP H0119770Y2 JP 4552783 U JP4552783 U JP 4552783U JP 4552783 U JP4552783 U JP 4552783U JP H0119770 Y2 JPH0119770 Y2 JP H0119770Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- board
- insulator board
- contact
- fixed contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4552783U JPS59150115U (ja) | 1983-03-28 | 1983-03-28 | スイツチ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4552783U JPS59150115U (ja) | 1983-03-28 | 1983-03-28 | スイツチ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59150115U JPS59150115U (ja) | 1984-10-06 |
| JPH0119770Y2 true JPH0119770Y2 (en]) | 1989-06-07 |
Family
ID=30176043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4552783U Granted JPS59150115U (ja) | 1983-03-28 | 1983-03-28 | スイツチ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150115U (en]) |
-
1983
- 1983-03-28 JP JP4552783U patent/JPS59150115U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59150115U (ja) | 1984-10-06 |
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